Showing posts with label semiconductor chips. Show all posts
Showing posts with label semiconductor chips. Show all posts

Tuesday, June 05, 2007

Column: Running Intel's Numbers

Forbes.com


Letter From Silicon Valley

Numbers are the lifeblood of Intel. Here are some of the numbers that can make--or break--the company, including how many bits of data its chips can crunch, the power those chips demand and exactly how much it costs to make each chip.

My recent story on Intel described the struggles within the company to get performance and power numbers right and the pain of trimming the costs of running the entire business. So far, Intel has cut staff, most significantly in marketing and management. But Intel's executives have more controls at their disposal, and how they tune those dials can be a strong indication of the health of the business today and over the year to come.

Those controls are buried deep in the intricacies of chip manufacturing. A neighbor of mine joined Intel in 1974. She remembers working in its first factory in Santa Clara, Calif., using scissors to cut circuit patterns into "rubies," sheets of red plastic. After she finished, others would take those ruby "masks" and shine light through them, exposing the surface of a silicon wafer covered with light-sensitive goop called a photoresist.

The chemicals hardened, forming a protective cover for the silicon. Then the silicon wafer was bathed in an acid bath to "etch," or dissolve, unwanted portions. Coat, expose, etch, rinse and repeat. The process would go on until the silicon was fully patterned with the electronic design.

I thought of my neighbor a few months ago when I visited one of Intel's finest "fabs" in Chandler, Ariz. The process is still called "lithography," but it bears as much resemblance to the work of 30 years ago as a robin does to a dinosaur.

The Chandler fab is an enormous squat building. Although it is staffed night and day by people, sturdy robotic boxes with an equally sturdy name ("Front-operating universal pods," or "FOUPs") run the show.

No person--even one suited up in one of Intel's stylishly androgynous "bunny" suits--ever touches a wafer. Instead, stacks of 25 wafers are encased in plastic cassettes. FOUPs, which travel along narrow gauge tracks in the ceiling, shuttle the cassettes from one stop to the next: to a machine that smears photoresist chemicals onto the wafers, or maybe to a machine that exposes them to ultraviolet light.

Coat, expose, etch, rinse and repeat. Some of the machines are so massive they require special bolts so that the floor beneath them will not buckle. All cost millions--even tens of millions--of dollars apiece. After about 60 days, the cassettes will have finished their Disneyland-like odyssey through the fab. They will have covered about 32 miles in their FOUPs. And then they will be shipped to another factory, where they will be sliced into individual chips and assembled into boards or modules for customers.

By the end of this year, Intel will be able to make chips with components measuring 45 nanometers wide. That size means designers can squeeze more than several hundred million onto a silicon chip smaller than a postage stamp. By contrast, Intel's 8080 microprocessor, introduced in 1974, had 4,500 transistors connected by circuit lines measuring six microns wide.

As the transistors get smaller, the silicon wafers are getting bigger. Today's top of the line silicon wafers measure 12 inches across; their immediate predecessors were a mere 8 inches in diameter. Thanks to the magic geometry of circles, the larger wafers have twice the surface area of the smaller ones. Better manufacturing techniques mean Intel has to use less energy and water to pattern the big guys.

Bottom line: It costs Intel less (in variable costs) to crank out chips in its latest and greatest fabs than it does in older ones. By next year, four of those 12-inch wafer fabs will be equipped to make chips with components measuring 45 nanometers.

The more chips Intel can build in its new fabs, the better its profits.

Or turn it around: Getting rid of some of its older fabs will perk up the bottom line.

Right now, Intel has a stable of 16 fabs operating or under construction, half of which can handle the big 12-inch wafers; the other half process smaller 8-inch disks. Five of those older fabs are in the U.S.

Intel has already put a Colorado fab up for sale and said it would cut the workforce at a New Mexico site by about 1,000 employees. Intel also recently said it would fold its assets for building a type of Flash memory into an independent company, formed jointly with STMicroelectronics.

That leaves five older fabs, including an operation in hometown Santa Clara.

In past years, Intel has converted older fabs so they can make smaller chips or work with larger wafers. But it's a numbers game: Since larger wafers can produce so many more chips, how many factories does a company really need?

Here's my bet: Between now and the end of the year, we'll see Intel sell off some of those older 200-millimeter fabs. Even the Santa Clara location could be on the block.

When that happens, you can expect to see the bottom line benefit--profitability will improve for at least a couple of quarters.

Once the endorphins of selling assets wear off, management will be left with the toughest task of all: growing the business.

With this contribution, I'm starting to morph this column into more of a blog-like conversation rather than a classic piece of reporting. Your comments are most welcome; you can send me a note at ecorcoran@forbes.com. If you do, please let me know if I can share your comments with readers.

http://www.forbes.com/home/technology/2007/06/04/intel-chips-fabs-tech-cz_ec_0605intel.html

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Monday, June 04, 2007

FORBES: Intel Plots A Comeback

Forbes.com

Intel's boss was raised on the inside. Now he must turn it inside out.

Intel Corp. was mired in misery early last year. After two decades dominating the microchip market-- one of the fastest-moving and most unforgiving businesses in the world--Intel seemed lethargic, lagging and stumble-prone. Big layoffs were imminent. Its stock price, having reached $75 in the fall of 2000, had stalled in the $20 range. Net income topped $10 billion in 2000 but had fallen to only half that in the years since. Worse, Intel was getting bested, badly, by a pesky producer one-sixth its size. After years as an also-ran Advanced Micro Devices in 2003 had upstaged Intel's muscle-bound chips, namely Itanium and Pentium 4, Intel's centerpiece. Big customers--IBM, Hewlett-Packard and, eventually, Dell--began turning to AMD. In 2005 Intel lost 2.6 points of market share, far more than it had expected.

Moreover, forays for new growth were fizzling: A big move into new chips for cell phones flopped; a plan to create a business running server farms for corporate clients faded; a billion-dollar gamble on Itanium, a new-generation chip for big servers, failed to pay off. The efforts had been plotted by Craig Barrett, the materials-science engineer who in 1998 succeeded Andrew S. Grove, the salty leader who had helped start the company. Barrett was helped by a successor of his own: Paul S. Otellini, an Intel lifer who in mid-2005 became the first non-Ph.D. to run Intel.

Unaccustomed to losing, Intel's ranks pelted their new chief with bitter e-mails: Intel had lost it; management was incompetent. Some likened Intel to a lumbering Detroit carmaker. Today Otellini, 56, is reluctant to talk about the backlash, though his chagrin is apparent. His de facto number two, Sean Maloney, is more blunt: "It was a swift kick in the gut. We were angry and disappointed in ourselves." He adds: "We just had a visceral emotion: We're gonna fix it."

That frustration pushed Otellini to wage the most sweeping overhaul at Intel in 20 years. Gone are plans for diversifying away from Intel's chips. Gone is 10% of its workforce. Otellini also bailed Intel out of cell phones, selling off the XScale mobile-chip line. In a first for the company, he has put one chip factory--so far--up for sale. And Otellini is reorienting Intel's focus to look beyond its slow-growth mainstay, processor chips for desktops, to what he hopes will be the Next Wave. This is a world of lightweight notebook PCs and a gaggle of ultramobile machines smaller than a laptop but bigger than a BlackBerry. "The PC market has been very good to us. It's near 300 million units [a year]. It's going to grow to 500 million units," he says. "But how do we sell a billion of something? Can we create a multihundred-million-unit market, per year, in handhelds?"

Intel already had in place a growth engine that could fuel its comeback: Centrino, simpler, faster and cheaper than the Pentium 4. The design began with Intel engineers in Haifa, Israel, far from Silicon Valley. Centrino would power notebook computers--but the "core" processor at Centrino's heart would become the inspiration for all of Intel and lead to a starkly different design than the Pentium, which had reigned since 1993.

In Silicon Valley Intel engineers thrived on using every available transistor to get more speed and power from a chip. The adverse side effect: lots of waste heat. The 178 million transistors in Intel's top Pentium 4 give off enough heat to fry an egg.

In the new-gadget era envisioned by Otellini the chips must be the antithesis of a hefty Pentium--sleeker, simpler, far cheaper and, above all, cooler. Lash a couple of processor cores together and bundle in specialized parts for, say, wireless linkups or video graphics, and this system can power everything from a palmtop to a server. Intel says a new family of cores, aimed at mobile devices, will be ready next year.

"How do we fit inside of something that sells for $100 and make some money?" Otellini says. "Costs become essential. Architecture becomes essential. Integration becomes essential. And the culture of the company has to wrap itself around that." This threatens "the ego of the Intel engineering community," says Maloney, executive vice president. "Their whole notion of self-worth was based around bigger and faster. That aspiration needed to change to cooler, sleeker, smaller. That's a big deal."

Thus Intel has abandoned what may be the most prodigious platform--the cell phone, with 1 billion units sold last year, four times the number of PCs--in favor of a new gadget that barely exists. Succeeding requires Intel to do two things it never has done particularly well: make chips at the lowest cost possible and let customers' demands shape development.

The Intel of old held 85% of the PC microprocessor market and routinely dictated upgrades and designs with little input from the clientele. AMD Chief Hector Ruiz tacitly goads Intel for this: "We did something that, unfortunately, is all too rare in the semiconductor industry--we went out and talked with [customers] about what [they] needed," he said in an industry speech in October 2006.

The new Intel must undergo a personality transplant. The Intel that Andy Grove built had enshrined sharp confrontation as constructive engagement, in the imperious and emphatic style of its chairman, for whom decisions were crisp, choices were binary and markets were won or lost.

Otellini, who scoffs privately at the "cult" that can surround a company's founders, can deliberate something to death. He deploys a reserved manner and prefers persuasion over fiats, consensus over combat. Frustration or embarrassment shows in a red flush to his face. His equanimity is a mixed blessing. It can be seen as indecisiveness.

He was born and bred in San Francisco, and during his college years he spent a summer working with his father, a butcher, in a slaughterhouse. ("I think he did that on purpose, because he didn't want me to ever think of that as a career," Otellini has said.) He attended the University of San Francisco, and in 1974 he landed his M.B.A. at the University of California, Berkeley, joining Intel as an analyst. He hasn't missed an Intel paycheck since. He rose in marketing and management--"I'm a product guy"--and spent a year in 1990 as an aide to Grove.

Barrett succeeded Grove in 1998 and began looking beyond microprocessors, a business he derided as a "creosote bush." (In the desert a creosote bush poisons the ground around it to ward off other vegetation.) He had Intel spend $10 billion buying communications and networking firms, even as it invested hundreds of millions more in the Itanium chip project with HP.

By 2002 the dot-com crash and the collapse of telecom had devastated Intel's profits and chilled Barrett's plans. Intel's move into chips for mobile phones had become a quagmire. Although the company had grabbed a promising chip line in a legal settlement with the old Digital Equipment in 1998 and renamed it XScale, the chip wasn't enough. Unlike the PC world, software for such chips was patchy. Even making the chips proved more costly than expected as Intel had to rejigger manufacturing processes.

"In hindsight, phones--even the smart phones we targeted--was not an area in which we had 20 or 30 years of expertise," says Otellini, who became president in early 2002. "It didn't play to any of our strengths. We didn't have the software or the architecture." Nor did Intel have many customers. Research In Motion put XScale into its BlackBerry, but cell phone makers were leery of Intel's reputation in PCs for reaping most of the profits and leaving boxmakers with less. "There were entrenched players, many of whom had seen the PC movie," Otellini says.

Meanwhile Intel was getting into trouble in microprocessors. The Itanium, in gestation since 1994 and a few years behind schedule, faltered when customers balked at the hassle and the cost of rewriting old Intel-based software for the new chip. Worse, the Pentium 4 was a hothead and a power guzzler, at a time when corporate customers eyed even electricity bills in a bid to reduce their tech spending.

AMD, Intel's plucky rival, was poised to benefit. Its engineers had been working on a homegrown chip that rivaled Intel's high-end Itanium for power but easily ran existing software. And it was cool--generating less heat than Intel's big chips. AMD debuted its Opteron for high-end servers in April 2003 and rocked Intel's world. The competition would knock the average selling price for high-end chips from more than $600 apiece in 2003 to half of that today, says IDC analyst Shane Rau.

Intel, meanwhile, had glitches. It canceled one new version of Pentium 4, ran a year late on another, delayed several other products and ran short of chips because of bad forecasting. Only the transition of the chief executive job from Barrett to Otellini, in May 2005, went smoothly. Intel stock rose 8% in calendar 2005; AMD's rose 43%.

Then Intel stumbled in a spectacular way: It missed sales forecasts on Wall Street two quarters in a row, through the first quarter of 2006. And Intel was bloated. In 2000 it had 86,000 people producing $34 billion of revenue; by 2006 it had added 17,000, though the top line had grown only 5%.

Otellini spent much of last year handling the fallout--disillusioned employees, the board demanding to know why Intel had slipped so badly, a huge round of layoffs. Yet Intel already had a key element in place for a dramatic comeback--the processor core inside Centrino.

In 2000 Otellini, then head of Intel's microprocessor business, had realized slim notebooks would need a cooler, less power-hungry processor than the Pentium 4. So he set engineers in Israel to the task. They approached it in a non-Intel way, sacrificing some raw power to get a chip that ran cooler. The idea was scorned inside Intel. "The company had been so successful in the 1990s it was hard to talk about doing things differently," says David Perlmutter, who led the project. "It was easier to be remote and question the basic religion of the company."

In 2002 their work was all but finished, when Otellini had an epiphany: Notebooks and laptops had to be able to connect wirelessly to the Internet. So Otellini decreed that the new chip should wait until the engineers could fuse their core to a homegrown Wi-Fi component. "Making that decision was tumultuous inside of Intel, to say the least," he says. "It was a cultural issue. We're a microprocessor company." The Intel faithful disliked delaying a new chip to wait for adjunct technology. One computer maker jeered at the project, calling it "Latrino."

Intel rolled out its Wi-Fi-ready Centrino in March 2003. Six months later the new chip was a much-needed hit. Intel's Perlmutter was convinced he could see the next horizon. "The first Centrino wasn't bad," he says. "But could we evolve the architecture to be better than the Pentium 4?"


It could. A Centrino-like core was anointed as Intel's flagship for notebook and desktop PCs. In October 2004 Otellini canceled future Pentium 4 efforts. He signed on for a big test of whether Intel's engineers could shed their dictatorial ways to work closely with a most demanding customer: Steve Jobs of Apple.

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After much wooing by Otellini, Jobs had agreed to consider using the next core, so long as Apple engineers could work hand in hand with Intel's designers. And in mid-2005 Jobs took the stage at his annual powwow with developers to announce that the Apple Macintosh would start using Intel chips. Since the Mac's debut in 1984, it always had run on chips from Motorola and its partners. Otellini gets coy when asked whether Intel might eventually surface in the Apple iPhone, due in June.

In spite of Centrino's success, Intel overall was sagging. Early last year Otellini hired consultants from Bain & Co., who huddled with some of Intel's smartest managers to take a snapshot of the company. Their report, two months later, stung Otellini and staff: Intel was fat and inefficient, hampered by high costs and a swollen marketing department. One example: Intel had too many "two-in-a-box" managers (a pair who share title and job). One set even jointly oversaw a staff of one.

"We weren't used to the sniping. No one had questioned us for years," says marketing chief Sean Maloney. But instead of demurring, senior execs focused on a fix. "How could you let Intel fail?" he says. "We're the company that's famous for technological change. The sense of personal shame would be overwhelming."

But Intel stumbled again in launching its rescue mission. Led by the deliberative Otellini, the company imposed job cuts so slowly that the ranks grew ever more angry. Intel first told Wall Street it would analyze the company's structure but didn't cite layoffs. Later it said it would fire a thousand managers. In June 2006 it sold off the xscale mobile chip line to Marvell Technology Group for $600 million, shedding more staff. Only in September did Otellini & Co. put a number on the layoffs: 10,500 jobs, or 10% of the workforce, the biggest cut at Intel since it abandoned the memory-chip business in 1985. More layoffs loom as Intel weighs selling the weakest part of its business making flash memory (used in cell phones and cameras) by year-end.

Now Otellini plies new growth. Intel's sales of various "core" chips (including the Centrino and the "Core 2 Duo" lines, both inspired by that original core approach in Centrino) will exceed sales of its classic design this year. Notebook chips are gaining fast: By 2009 Intel figures it will ship more chips for notebooks than for desktop PCs--happy news because at least for now Intel makes more money on notebooks.

Next: chips for the ultramobile handhelds. These will incorporate, on one piece of silicon, a Centrino-like core plus circuits handling such tasks as Voice over Internet, graphics for games and search. Otellini argues that by 2011 such chips could compete in what he expects will be three newly formed $10-billion-a-year markets--one each in mobile, consumer electronics and supercheap PCs for the Third World. That enhanced core goes for now by the name Silverthorne.

"Silverthorne could really be a thorn in Intel's side," frets Auguste Richard, a senior analyst at First Albany Capital in San Francisco, who nonetheless admires the Intel overhaul and has a "buy" on the stock. Any system-on-a-chip revenues for Intel are a few years away. Wall Street also worries about the inevitably thinner profit margins in chips for cheap palmtops.

Intel never had obsessed over cutting product costs. "You would never have had a discussion with Andy [Grove] or Craig [Barrett] about us being the lowest-cost producer," Otellini says. When a company has products that could command as much as 80% margins, he notes, "costs are important but not critical." But cost will be everything in the handheld market, and Intel is counting on its mind-boggling prowess in manufacturing for an edge.

It makes some of the tiniest chips ever created for a PC, cramming them onto the largest silicon wafers in the world. It now has 5 factories (of a total 16) that use platters 300 millimeters across (12 inches or so). By year-end Intel will produce chips with transistors measuring 45 nanometers (45 billionths of a meter), smaller than most human viruses. That will let it etch 2,500 chips on each 300mm wafer.

Otellini bets Intel can stay so far ahead of rivals that it can make chips as cheaply as any competitor. That includes China, which is emerging as the foundry for the rest of the chip world. "We've been benchmarking them. We don't think we're at a cost disadvantage," he says. In March Intel set plans to build its next chip factory, typically a $4 billion project in the U.S., in Dalian, China.

But Intel will have to prevail over fearsome foes: Samsung and Texas Instruments, established vendors of chips for the picky cell phone business. And Intel's new push will require its engineers and managers to cater to customers in ways they never have before.

"Intel talks about being customer-centric, but it's not in their DNA. They've been brought up to rule the world," says Henri Richard, AMD sales chief. When he meets with phonemakers, they tell him what they want, what a chip should do and how much it should cost. In PCs, "Intel tells the customer: 'This is the way it's going to be.'"

At TI, Senior Vice President R. Gregory Delagi says his company has spent a decade learning to coddle clients. It reorganized its supply chain to have TI products ready just across the street from a customer assembly plant. During the tech slump in 2001 TI built a site for a customer within its own factory in France to let the client's engineers work alongside TI staff.

But Intel execs say they learned how to mollify customers as fussy as Steve Jobs. And they vow that their foray into the ultra- mobile market will fare better than their effort to make chips for cell phones, in part because Intel's cores are heirs to the mountains of software written for the 850 million or so Intel-based computers in the world today.

"That's the heart of why it was important for us to make the changes we made last year," Otellini says. A billion computers now link up to the Internet, most of them Intel-based, and it took 12 years to reach that milestone. The next billion machines will come online in only half as much time--and Intel will have to fight hard for every single one of them.



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Q&A: A Talk With Intel Chief Paul Otellini

Forbes.com

(originally published online on 5/17/07 but part of magazine 6/04/07 package)

Excerpts from a Q&A with Paul Otellini, chief executive of Intel.

Forbes: When did you think Intel had to change?

Otellini: My epiphany for driving our strategy came around 2002. We were leading up to the launch of what ultimately became Centrino. I felt very strongly that wireless communications as an integral part of a notebook experience was a killer market opportunity. Six months after launch, it became very obvious that this was a home run.

Around the same time, I changed our planning processes. We had had a microprocessor group, a chip set team, a server group and so on. I said, "We're going to turn this around and identify the end markets and do our planning from the markets backwards." So we changed product planning inside of Intel to be around platforms. It played to our unique advantages--silicon technology, platform architecture knowledge and the ability to scale massively.

Intel had accumulated something like $10 billion acquisitions in communications and networking. Did you have to do that?

There was certainly some communications architecture expertise that we didn't have inside the company. Our work in wi-fi and WiMax came out of those acquisitions. Clearly, one of the larger areas of investment was in the handset division, which we exited. There were a lot of lessons learned there. We saw that there wasn't a way for us to make good money there. But I believe very much that the future of computing is in handheld devices.

But if the future is in handheld devices, why get out of handsets?

It's a lot easier to add voice to a computer than to add computing to a phone. We're not just shrinking the notebook. We're asking, How do we provide a full Internet experience that also includes voice, in a handheld form-factor? I think the Internet is the killer app of mobile computing. Of all computing. The Internet runs on Intel architecture today.

So our view is, if you could deliver the full computer experience, in a handheld form factor, with the right kind of power and performance characteristics, then you have a very interesting product. And in that business, we compete based on our strengths, not our weaknesses.

Is the business model for the ultra-mobile industry going to look like the PC world?

I don't think so. We're not taking the PC business model into this area. We're taking the Intel architecture, which runs most of the Internet, into new devices. These are not going to be $200 chips, inside of a $200 phone. You have to deliver the right kind of performance to run the applications, have the right power envelope to give you the all-day battery power, and the right price to hit the sweet spot for the consumer. That means high integration of technology and moving to very small chips and system-on-chip architectures.

Saying, "I'm going to take a pre-existing architecture on which a billion Internet devices run today and move that into handhelds" is wholly different than saying, "I'm going to take the PC business model and move that into handhelds." It's a whole different model. There's different software to some extent. Windows is a player there but not the only player. And you can see that with Apple emerging.

More and more chip manufacturers have stepped back from manufacturing chips and instead are relying on foundries. What about Intel?

Chip manufacturing gets harder and more expensive all the time. It's basically the laws of physics and the laws of economics at play. To build a modern semiconductor plant which uses 300-millimeter wafers, and state-of-the-art lithography with designs measuring 45 nanometers, costs close to $4 billion. Then there are the tools inside it, which amount to close to a billion dollars, per generation of technology. That means you need to generate $4 billion to $5 billion a year in revenue out of it. There are not many semiconductor companies that are $5 billion or more in revenue. So economics leads many companies to collaborate.

No. 2: The laws of physics mean chip making gets harder and harder. We think we have some breakthrough technology at 45 nanometer. We think it will be harder for people to do that than it was in the past at, say, 65 nanometer or 90 nanometer. Our lead over the competition may extend with this generation and probably extend a lot after that. This is not a macho thing. It's all based on sheer economics.

As the Internet and hopefully our architecture come into the world of consumer electronics and handhelds, the price points are not going to be $1,000 but a few hundred dollars. So we have to be able to get this to low-cost, high performance single chips. And make reasonable profits.

Will Intel work differently with these device makers than it has with PC companies?

Over time, the answer is yes. And what we do in the PC space will change too. As you move towards system on a chip, particularly in ultra-small devices, different customers will have different requirements for what's on the chip. We may have to do derivative versions or semi-custom versions--and create ways customers can exploit their own intellectual property. We do some of this today in packaging. And in some areas of consumer electronics we're building system on chips for certain classes of devices such as set-top box makers.

What about Itanium?

It's used for really big machines: the Tokyo stock exchange, mainframe replacements. There are two models for high-performance computing: scale up and scale out. Itanium is a mainframe scale-up kind of machine. Google, with its zillions of racks of servers, is a scale out. At some point in time, the scale-out model may prevail. But for right now, for some classes of applications, particularly ones for organizations where systems have to be ultra-reliable and high performance, scale up still matters. And Itanium is our best architecture for that today.

What's been your hardest decision?

The one that led to us having to downsize. It was pretty obvious at the analyst meeting last year that we said some of our basic economic models, which had existed for many years, were changing. We had to get leaner, get more focused.

What have you learned by being on the Google board?

Much of the success of Google, apart from obviously their technology, is their aggressive willingness to partner and to make their partners successful. Google says, "You, Mister Partner, and I can create a huge opportunity to monetize assets that you may have. You can do it on your own, or you can do it with me and my scale, and I'll cut you in on it." And that "cutting you in on it" has been the heart of much of Google's growth.

That business model of setting up opportunities where you share mutual success financially has not been a model that has been inside this company or even in the classic PC space. I think this is a very interesting model for us.

http://www.forbes.com/2007/05/17/intel-otellini-chips-tech-cz_bc_0517otellini.html?boxes=custom

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Q&A: A Talk With AMD Exec Henri Richard


Forbes.com

(originally published online on 5/17/07 but part of magazine 6/04/07 package)

Q&A with Henri Richard, Advanced Micro Devices' chief sales and marketing officer.

Forbes: How did AMD become such a meaningful competitor to Intel?

Richard: We decided to go out with a strategic direction that was different from Intel's. Before 2002, Advanced Micro Devices had partial success in the consumer market. We understood that the way to greatness was not to ape Intel but to differentiate our solution. If it weren't for AMD, everyone would be speaking "Itanium." Customers need to trust you. I'd like to put a lot of credit to the new AMD management team for demonstrating that. Customers want to know: Are you real? Are you going to support me? Will you deliver on the promise?

I tell my kids, "My job is to sell freedom." I don't sell products. Our chips are fully compatible with Intel's and vice versa. Sometimes we're faster, sometimes they're faster. But essentially the market aspires to have choice. The last thing you want is for every PC or TV to be the same.

What's different about your approach from Intel's?

When I meet with customers in the cellphone or TV business, they present their vision of where they want to take their product, and they tell me what they want the components to be, what they should do and how much they should cost. Then they say, "Can you do it for me?" In the PC space, Intel tells the customer, here's the roadmap. This is the way it's going to be. Since when does every customer in the world decide that every other year is the right schedule to upgrade their chip? They talk about being customer-centric, but it's not in their DNA. They've been brought up to rule the world.

Intel looks at everyone as an extension of their business. We look at ourselves as an extension of our customers' business. It's not just about the products or the technology. It's the fact that we're fundamentally changing the business model.

Do we really need "ultramobile" PCs?

I don't know if it's a fat cellphone or a thin notebook. But there's clearly a missing link in mobile devices. If you have a fat cellphone, you're compromising on computing power and on visual quality. If you have a notebook, you've got computing power but you're trading excellent autonomy and connectivity. At the convergence of these devices, something will emerge: where the screen is good enough, the keyboard is good enough and the connectivity is good enough so that you don't need a Ph.D. to make everything work. That's the device we would all love to have. Then we wouldn't need to carry around two or three devices.

Will it come? Absolutely. Why is it so difficult? There are technology challenges, engineering compromises. And you have a clash of industries: The PC guys are always trying to get in a PC-centric view of the world, but they don't always have the greatest consumer insights. PCs are still way too frustrating and too prone to bugs and errors. If my refrigerator was like my PC, I'd have to wait 60 seconds to get a beer.

AMD has had an awful quarter. How do customers know you'll be viable?

I can't deny the recent quarter was a negative. But there are two ways to look at business: performance and health. There's what you see in the earnings. But what is the AMD customer saying to us? What's the end user demand? We had a series of challenges because we grew so fast in 2006. It put us in a position to disappoint some customers.

Although I can't look at Q1 with anything but disgust, this has never been anything other than a marathon. I look at Q1 like an anomaly and am confident that customers, users and employees' motivation and determination is intact.

You have already teamed up with IBM on research. You've suggested that you might give up manufacturing, too. Is this is a viable strategy?

Increasingly it's going to be a world of partnering, because there are more good ideas in several brains than in just one. And the costs barriers to entry are getting enormous. As the PC industry matures, it's not as homogeneous as it used to be. There's a need for "good enough" devices, where the focus is on keeping costs low. At the other end of the spectrum, there will be this incredible need for performance.

The race in chip design needs to change from "I'm doing it because I can" to "I'm doing it because it's meaningful to the end user." If there's one thing I can be proud of, AMD has helped Intel improve its game. If it hadn't been for AMD, Intel's way of addressing the market would have remained static. I give them a lot of credit for looking at the competition and forcing themselves to change.


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Monday, April 17, 2006

Forbes: TI seeds IT

TI Seeds It
Elizabeth Corcoran
477 words
17 April 2006
Volume 177 Issue 8
(c) 2006 Forbes Inc.

Texas Instruments was the first international chip company to open an office in India when it set up there in 1985. Some 2,500 people applied for jobs; TI hired 16 and put them to work in Bangalore. Oxen helped haul equipment to the new office.

Twenty-one years later TI India has blossomed into a formidable 1,200-person research-and-development team and local celebrity. A leading Indian television quiz show recently asked: "What was the first digital signal processor designed in India?" Contestants vied for a chance to shout the answer: "Ankoor!"

In two decades TI India has trained dozens of engineers to be managers. Now some of them are launching their own firms, and the welter of castoffs is great news to the company they quit: They build the software and circuits that help other companies make use of TI chips.

In December TI rolled out DaVinci, a powerful new platform of digital signal processors. Developing it took a multiyear effort by TI-ers around the world. India contributed much of the software and systems technology for these chips, which, at a cost of up to $35 apiece, can be the brains of videophones, video security systems and other devices.

Five weeks after DaVinci appeared, a company called Ittiam Systems was showing off a working Internet phone based on DaVinci at the Consumer Electronics Show in Las Vegas. Ittiam's inside track? It's a five-year-old Bangalore software firm, founded by five TI India alumni, including Srini Rajam, who in 1995 became the first Indian managing director of TI India.

Rajam was among TI India's original team of 16. By 2001 the itch to run his own show was too great. The name "Ittiam" is an amalgam of the first letters from the René Descartes statement: "I think, therefore I am." "It tells our message," Rajam says. "Our thoughts will lead to our destiny."

Ittiam builds working prototypes based on digital signal processors such as those from TI. Ittiam doesn't worry about design niceties such as color or styling. It simply shows off every muscle of a new chip-how well it supports three- or four-way videoconferencing and how it can capture and play back speech. Customers such as Sony and Microsoft can cherry-pick the features they want in their products. What goes into their shopping carts: TI's chips and Ittiam's software for gluing system elements together.

By late March Ittiam was already in discussions with an equipment maker keen to license the technology. But it offers a payoff for TI, as well. "No one wants to see employees leave,"says R. Gregory Delagi, a TI vice president, "but we're doing more than R&D. We're building a big ecosystem in India."

(Back To Chips and Biryani)


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Forbes: Chips and Biryani

Chips and Biryani; How one U.S. tech company builds business by arming the offshorers of India.
Elizabeth Corcoran
2262 words
17 April 2006
Volume 177 Issue 8
English
(c) 2006 Forbes Inc.

How one U.S. tech company builds business by arming the offshorers of India.

Michael Fister has come to India not to save money but to make money. He has seen opportunity budding at Beceem Communications, a young chip design company tucked into a few floors of a building in a bustling residential area of Bangalore. He has watched it surge at Wipro, one of India's outsourcing giants. And Fister has spotted a burst of opportunity at MindTree, an R&D and consulting firm that is building a 15-acre campus west of downtown Bangalore, a few kilometers away from streets choked with shanties.

Fister runs Cadence Design Systems, a $1.3 billion (sales) vendor of software and systems for chip design and testing. Consumers shopping for a cell phone or a handheld video player won't encounter Cadence, but without Cadence the gadget they want might not exist. Now Cadence, in San Jose, Calif., aims to fuel the next wave of offshoring, one that takes not just the help desk but the engineering department abroad. Cadence sells its tools throughout the world. But while China is fast becoming the world's manufacturing center, India is using its expertise in software to leap into the next innovative zone: designing chips.

"We want to be part of the world as it grows and to tap the passion, intelligence and pride of people building these new markets," Fister says. Cadence got an early start in India, opening a development office in 1987, the same year it was founded. Now it employs 900 there. Revenues are still modest. Asia (excluding Japan) accounted for only 9% of Cadence's sales last year, but India's share is growing: The firm has 160 chip design clients there, up from 15 in 1998.

So far Bangalore, India's high-tech city, has been home to most of the country's chip-design companies. But another flavor of biryani, the famed rice dish of southern India, is on the rise: In February a government-industry consortium picked Hyderabad as the spot for India's first chip-assembly-and-testing facility.

Offshoring chip design promises to turbocharge business, letting companies produce more products quicker than ever before, and at low prices. Imagine it and India's tech wizards will design it, then Chinese factories will churn out the chips for it: It's just-in-time invention.

U.S. companies can leverage this system rather than fear it. Every new chip is the basis for a score of devices; every device sparks ideas for a host of software applications. "You build a foundation around semiconductors," notes Fister. "Then you can build industries around it."

Fister, 51, has seen this multiplier effect before. A lean man with a taste for racing bikes and geeky technology, he spent 17 years at Intel. He helped Intel segment the Pentium into the troika of Xeon (high end), Celeron (low end) and Pentium classic, a move that drove up profits and held competitors at bay. He was an early advocate of starting a research lab for Intel in India. Intel committed itself to chip design in Bangalore in 2002; it has 2,500 workers there now, and they have made significant contributions, most notably to Intel's portfolio of mobile technologies.

To build business in India, Cadence has spent years working with government and industry. The company has become a big supporter of the fledgling India Semiconductor Association, which hosted its first conference in February. Last year Cadence trained more than 2,000 students and engineers in India to use its tools. The company offers payment schemes that let small outfits pay for its technology as their work brings in revenues. Fister has also pushed the idea of packaging Cadence's tools into "kits" with such themes as wireless networking or consumer electronics, to better fit the projects its customers are tackling. Fister delivers the goods himself, visiting even tiny companies to listen to their plans and offer ideas of how Cadence can help them grow.

On a recent February morning in Bangalore Fister arrives in a hired Mercedes at the door of two-and-a-half-year-old Beceem Communications, located in a busy residential area that's fast turning into a business zone. Beceem works on chips that provide high-speed, wireless Internet access for mobile devices.

"We're always interested in the most cutting-edge work," Fister tells Beceem's managing director Rajat Gupta, while admiring the upstart's first coup: a modem that can deliver Internet data to a laptop at 15 million bits per second even in a car moving up to 60mph. Beceem and its partners lashed together the device in under a year.

"We have about 40 people here doing chip design and another 40 doing software development," Gupta tells Fister, leading him briskly through a large room with yellow walls and green trim, filled with cubicles. Beceem, which means "wireless" in Persian, is an international hybrid. Although most of its engineers work in India, senior management and 40 engineers who specialize in radio-frequency technology are in Santa Clara. Most of its more than $30 million in venture funding has come from the U.S. (Intel and Samsung are big investors, too.) Its first customers are in Asia.

India has built up expertise in the design of analog circuits, those that massage smoothly varying signals (like the music from a speaker). Analog happens to be a Cadence strong suit. Five years ago only a few multinational tech companies could rely on engineers in a faraway land to handle chip design, but better telecommunications and automated design tools have changed that picture.

At 10:30 a.m. in Bangalore a handful of engineers are hunkered down in their cubicles, staring at circuit diagrams on their computer screens. U.S. companies prize high-walled cubicles for privacy. Here the walls are lower, encouraging engineers to lean over the partitions and brainstorm.

Gupta reaches a series of workbenches covered with electronic test equipment and picks up a printed circuit board the size of a short stack of index cards. "Here's our first modem," he says, one for mobile WiMax. WiMax is hot: At least 350 companies have signed on to the broad technology standard. Korea and India plan to roll out the technology this year. "There's not enough copper in all the world to connect everyone in India to the Internet," Gupta says. "That's why we think this technology is so promising."

Beceem develops mobile WiMax reference designs and analog-radio chip sets for customers that piece together those components and processors to build handsets, modem cards and such. Beceem engineers were working on their designs last spring when they got a call from a Korean electronics maker that wanted to show WiMax at an Asian economic conference in Korea in November. Would Beceem's chip design be ready?

Beceem said yes, and Cadence engineers flew from Noida down to Bangalore to help Beceem work through the nuances of using the design tools (and fiddle with the tools to make them solve a knotty WiMax challenge). After a string of 18-hour days Beceem finished its design in early July. A Taiwanese chip foundry made the chips. Tessolve, another U.S.-India hybrid, which set up a testing company last year, ensured that the chips worked. The demo at the conference in Korea wowed the crowd.

Now Gupta wants even smoother ways for Beceem engineers in the U.S. and India to synch up their contributions. "It would be impossible to have our whole team in one place," he declares. His reason is echoed by others across India: Development strictly in the U.S. is expensive; development strictly in India is hard to manage and to keep on schedule.

"When I was at Intel," Fister tells his Indian host, "I used to think that tool companies just sold you a package and then said, 'You're on your own.' We've cut out those yo-yos." He pledges to keep Cadence engineers working with Beceem to make the tools bridge the geographic distances.

On another day in Bangalore security guards halt Fister's car just outside gates that separate the Wipro campus, with its manicured lawns and quiet pond, from the dusty outside world of construction zones. The company started in 1945 as Western India Vegetable Products Ltd. A few decades later it had leaped into technology and outsourcing. A third of Wipro's $2.2 billion in annual revenue comes from R&D services it provides to makers of high-tech gear. Of its 52,000 employees, 1,200 work on circuit designs for more than 180 customers in 25 countries. Wipro doesn't manufacture final products (one notable exception: PCs for the Indian market). But it does everything else.

"It's like we're a hundred product companies in one," A.L. Rao, Wipro's chief operating officer, tells Fister, as lieutenants from Wipro and Cadence settle into chairs at a long polished table. Waiters glide into the room with silver trays of sodas, biscuits and hot, sweet coffee.

Vasudevan Aghoramoorthy, a Wipro vice president, displays a schematic of a product development, from concept to chip design to support for the final product. "Seventy to eighty percent of our work gets done in the middle, in the development phase," Aghoramoorthy points out. Wipro's fastest-growing area: testing everything from circuits in development to final products.

Testing is a subtle art, one that is going virtual. Engineers can create a model of how, say, a cell phone or advanced graphics processor should work and test it by simulating the systems (say, "pushing" virtual buttons) hundreds of times. But such is the complexity of these systems that even the fastest general purpose computers cannot test all the billions of possible combinations of hardware and software interactions that a cell phone or graphics chip may encounter. Put it this way: These days chips cannot keep up with their own brainpower.

Cadence's twist has been to add the elegance of inductive reasoning. Along with its specialty hardware engine, Palladium, Cadence adds mathematical techniques that prove the validity of chip designs. "I'll tell you what," Fister says, leaning on the table. "I'll let you try out the latest Palladium for a month. After you get to know how to use it, I bet you're going to realize how fantastic it is."

One drawback: The math-intensive nature of Cadence's latest tools forces engineers to relearn how to do testing. But Fister knows Indian engineers are often game to try new approaches, provided they pay off. Wipro's Rao likes Fister's overture, and a deal is set into motion.

Fister's last stop, at the end of a weeklong road trip that began in Europe, is at MindTree Consulting, a seven-year-old firm with 3,500 employees. Road fatigue is taking a toll; at lunch Fister skips an elaborate buffet of Indian delicacies in favor of a ham sandwich. The 50-minute drive to MindTree from downtown Bangalore shows India's many facets, from a smooth modern highway flyover to side streets jammed with blacksmiths, sweetshops, street vendors hawking bright flower garlands, people waiting for dusty buses and cattle.

MindTree was founded by ten people who had already had successful careers elsewhere. (Half are former Wipro executives.) MindTree wants to be an "aspirational company," Subroto Bagchi, the chief operating officer, tells Fister.

Every employee holds equity in the privately held company, which raised $24 million in funding, mostly from U.S. venture capitalists. MindTree's logo was designed by a child afflicted with cerebral palsy. ("It shows we believe there is much we can learn from everyone," Bagchi says.) The company hosts lectures by people from diverse backgrounds--dancers, astronauts and authors--aiming to "break the engineering mindset," he says.

"Ten years ago clients would just ask: 'How many C++ programmers do you have?'" Bagchi says. "Today we're getting asked to help design a concept. We're not just saving money for customers--we're creating value."

Fister gets recharged by hearing this. Like MindTree, Cadence wants to help its customers not just build products but deepen their expertise in new areas, he asserts. MindTree executives nod. In 2004 a Korean customer asked MindTree to develop a lithium-ion battery charger for cell phones, a device that required expertise in mixed-signal and analog design that MindTree lacked. Cadence helped out, Bagchi says, both by helping MindTree engineers learn to use the right design tools and by making the wares available in a pay-as-you-go program. Eight months later MindTree delivered the battery charger--and had built a new set of skills in a booming area. "We couldn't have made it without Cadence," Bagchi says.

Now, as Fister tours the MindTree labs, he suggests that Cadence's tool kits can help MindTree sharpen its skills and add to its intellectual property in radio frequency design. MindTree's executives are intrigued. The kits could speed up their development time. A month later, they decide to try out one of the Cadence kits.

As Fister sees it, the deal is another brick in the emerging Indian semiconductor economy. "It's about building a foundation," Fister says. "You don't have to reinvent everything."

--##--

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Monday, April 02, 2001

Forbes: Too Hot to Handle

Forbes.com


William Pohlman's 1999 retirement party, capping a 20-year tenure at Intel, had barely started when two former colleagues pulled him aside. They wanted him to help them start a new chip company, Primarion, which wound up focusing on regulating the energy demands of microprocessors. The back nine could wait. "I knew the technology megatrends that were creating problems for building future chips," says Pohlman, a former vice president of engineering in Intel's microprocessor group.





Two years later Intel (nasdaq: INTC - news - people) is pulling off breathtaking feats, squeezing 42 million transistors onto a sliver of silicon 217 square millimeters. Its new Pentium 4 churns through data at rates of 1.5 gigahertz; one gigahertz is a billion clock cycles a second.

But as chips get this dense and quick, they get hot�hot enough to boil water. The heat makes them so electrically "noisy" that they can fail. And the materials that enabled such chip density are reaching physical limits. Says Pohlman, now chairman of Primarion in Tempe, Ariz.: "We've hit an inflection point."

And it's a biggie. If nothing is done to rethink chip design, the most powerful microprocessors could be consuming more than 1,000 watts by 2004. "If it's business as usual, we wind up frying eggs" with microprocessors, says Dennis Monticelli, a Fellow with National Semiconductor (nyse: NSM - news - people) in Santa Clara, Calif.

Many of these problems could occur within two chip generations, about four years from now. Since it takes about two years and more than $1.5billion to build a new semiconductor factory, chipmakers are rolling some expensive dice betting researchers will find solutions in time. "Our goal is to make Moore's Law work for the next decade," says Patrick Gelsinger, chief technology officer at Intel, referring to the tenet that the number of transistors on a chip doubles every 24 months.

Doing so, however, will demand changes in the design of chips and the materials that compose them. At a recent industry conference, Gelsinger declared that managing heat is now one of the industry's top challenges. Switching every transistor off or on requires a touch of energy. As transistors shrink, it becomes impossible to completely turn them off, so they leak current all the time. That draws electricity�50 watts in the case of the Pentium 4�and the electricity creates heat. Without the use of cooling techniques, temperature spikes above 105 degrees centigrade have occurred. Piping out the heat is expensive. Even simple "heat sinks," chunks of material that carry heat away from microprocessors, can add $16 to the cost of a $600 chip. More elaborate models, with tiny chambers of water that vaporize and carry away heat even more quickly, can run twice the cost. Computer makers hate adding gizmos to their boxes to flush out heat, preferring to save the room for gear that makes their machines more appealing.

New cooling tricks are starting to emerge. In late February the fledgling Incep Technologies in San Diego introduced a technique for packaging together a microprocessor, a logic board for regulating power to the chip and a heat sink. Even though such "encapsulation" could cost $200 per unit, Incep President James Kaskade contends that it both cools the chips and saves space inside the box.

Isonics Corp. (nasdaq: ISON - news - people), in Golden, Colo., a maker of specialty materials and chemicals, is proposing a new material:a "purer" version of silicon called Si-28, which channels out heat better than conventional silicon. The silicon in typical wafers is a blend of three silicon isotopes. Sifted down to just the Si28 isotope, Isonics' wafer conducts heat better.

Even though Si28's thermal properties are attractive, changing materials could be an expensive option, adding at least 25% to the cost of the wafer. Isonics Chief Executive James Alexander says he needs committed partners before manufacturing the first wafers. He claims that Advanced Micro Devices (nyse: AMD - news - people), among others, is experimenting with the materials.

Even better than getting the heat out would be generating less of it in the first place. Intel's Gelsinger is exploiting several tricks to make chips more efficient. Adding more local memory, or "cache," to a chip reduces the work the microprocessor must do to fetch needed data. Letting two microprocessing units share one cache cuts work even further. Designating a special section of the chip to handle common tasks also helps. So, too, does handling repetitive tasks together.

Both Intel and AMD are also trying to be smarter about how their chips use power by using software to deliver just enough juice to the chip to get a job done. "The chance that you need the highest performance at any one time is small," points out Frederick Weber, vice president of design engineering at AMD in Sunnyvale, Calif. Instead, chips might operate at clock speeds ranging from 300 megahertz to 1,500 megahertz, depending on the tasks.

Transmeta (nasdaq: TMTA - news - people), a much-talked-about Santa Clara newcomer, is taking a different approach entirely. Instead of slowing down a fast processor, it is using software to replace transistors. Transmeta's technique, called "code morphing," translates the instructions sent to a chip into bigger chunks that can be handled more efficiently. The result: Its Crusoe chip, which uses about 1 million logic devices such as transistors, is already used in Sony and Hitachi laptops. Transmeta and its competitors argue about whose chip performs at what speed. "Racing for megahertz isn't the goal�giving consumers a great experience is," says the company's founder and chief technology officer David Ditzel.

A more insidious problem, the one that lured Bill Pohlman out of retirement, is the dreaded power spike. Operating at gigahertz speeds takes a lot of energy, so designers must lower the voltage they apply to transistors so as not to fry the electronics. But at lower voltages the signal that pulses through the chip gets so weak it could get lost in the chip's electrical cacophony. Imagine 50 million doors slamming every fraction of a second. And, when the electric potential dips below one volt, devices may not get enough juice to switch. A power-hungry transistor will steal energy from its neighbors, causing a tiny surge on the chip. "Either you have to run your processor slower, or you could get a �blue screen'�the system fails," says Pohlman.

He thinks he has an answer to these concerns by judiciously managing the voltage. Primarion is designing small, special-purpose silicon germanium chips that sit next to a microprocessor, monitor its energy demands and supply the right amount of power at the right time. "We think it might add $20 to the cost of the microprocessor but it could run as much as 20% faster," Pohlman argues. Primarion's first chips, which operate about five times as fast as the top microprocessors, might be ready by year-end. (Silicon germanium chips run so fast because electrons travel more easily through the material than they do through silicon.)

As transistors get even smaller the materials that have been so reliable for chip designers begin to give out. One standard ingredient has been silicon dioxide, a combination of silicon and oxygen atoms that makes up beach sand and quartz crystals. Silicon dioxide has played two different roles for transistors: It insulates the tiny metal wires connecting those millions of transistors and manages the process of turning a transistor's power off and on, serving as a buffer between positive and negative charges. By thinning this "dielectric layer," designers have sped up transistor-switching. But it will soon be stretched about as thin as it can go: The silicon dioxide layer on the daughter of the Pentium 4 will be a mere six atoms thick. Designers can't scrape away too many more atoms or else those lines will touch or interfere, garbling the digital signals.

Researchers despair of ever finding another material that can both manage the switch and insulate the wires. That leads them in different directions: adding new materials to the dielectric material governing the switch and trying to concoct new insulators for the wires. IBM and others are trying a grocery list of materials. In early March, for instance, Dow Chemical (nyse: DOW - news - people) unveiled a porous organic material that it promised to make available as an insulator later this year. One radical idea for insulating the wires would be to leave nothing but air between them, says Daniel Dawson, a manager at IBM's Almaden Research Center. Such a chip might be too fragile, however.

Many solutions are under way, but if the biggest chipmakers don't settle on an approach, it will be difficult to drive down the costs of future chips. One compromise: throwing in a pair of oven mitts with every new computer.

Getting The Heat Out

To make more powerful microprocessors, engineers try to squeeze more transistors onto a single silicon chip. That means transistors have become vanishingly small. If Intel's top–of–the–line Pentium 4 processor measured 500 miles on a side, then each of its 42 million transistors would be only 19 feet across the top. But the tinier the transistors, the hotter the whole chip becomes. Here are a few of the techniques designers are trying to get the heat out. Just about all of these, however, add some cost and difficulty to chipmaking.
FIND A BETTER WAY TO
FLUSH OUT HEAT
USE DIFFERENT MATERIALS REDESIGN THE CHIP
1. Heat sinks. These are chunks of material that pull heat away from the microprocessor. Metal is a good conductor of heat, water is better. (Air is the best.) Some designers are building novel heat sinks with tiny water chambers. The water draws out the heat, vaporizes and, as it cools, condenses again.
2. "Encapsulate" a microprocessor. Startup Incep hopes to package a chip, heat sink and the ability to modulate voltage. By sliding the chip into this tidy package, it could expose more of it to air.
Some firms are exploring how different materials flush out heat or switch faster with less voltage.
1. IBM's "silicon on insulator" layers silicon and an insulator such as silicon dioxide where current passes through the semiconductor.
2. Materials–maker Isonics pushes the idea of using isotopically pure silicon wafers that have fewer crystal defects than conventional wafers. Electrons pass through with fewer road bumps, generating less heat. Isonics is seeking a commitment from a big chipmaker before it begins manufacturing such wafers. Chipmakers are nervous about the cost.
1. Add more local or "cache" memory. To do a task such as addition, a chip might have to fetch the numbers from the hard drive. Adding more cache memory means the chip does less work to find the data.
2. Add specialized processing blocks. Creating a section of the chip designed to handle repetitive tasks efficiently saves work.
3. Add another processor, but share the memory. Creating two processing units that share a large cache on the same swatch of silicon speeds up work.
4. Use software to find parallel tasks. In the most radical case, software might be able to reorganize a problem so that a chip can handle several tasks simultaneously. Software can also let a processor work as if it were two units when it's only one. -E.C.


Feeding the Pentium Beast

04.02.01
from Too Hot to Handle

Intel's astonishing march toward ever denser chips comes with a cost: skyrocketing energy demands. The prospect of 100-kilowatt chips has designers scrambling for solutions.

Projection figures assume no advances in energy efficiency techniques.

1Leakage is the dissipation of energy as a result of imperfect transistor function.

Source: Intel.


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